MSL XPC860ENCZP50D3 - MSL FPGA INC 專門從事 MSL MEISHILONG 可編程邏輯器件 FPGA 的設計與製造


Product Number	MSL XPC860ENCZP50D3
Category	微處理器
Package	357-PBGA（25x25）
Packing Method	散裝
Description	IC MPU MPC86XX 50MHZ 357BGA
Parameters	核心處理器:PowerQUICC™\|內核數/匯流排寬度:1 核，32 位\|速度:50MHz\|協處理器/DSP:通信；CPM\|RAM 控制器:DRAM\|圖形加速:無\|顯示與介面控制器:-\|以太網:10Mbps（4）\|SATA:-\|USB:-\|電壓 - I/O:-\|工作溫度:-40°C ~ 95°C（TJ）\|附加介面:GCI，HDLC/SDLC，I2C，PCMCIA，SCC，SPI，UART，TDM

Product Number

MSL XPC860ENCZP50D3

Category

微處理器

Package

357-PBGA（25x25）

Packing Method

散裝

Description

IC MPU MPC86XX 50MHZ 357BGA

Parameters

Contact Us:

MSL FPGA INC (USA)
Registered Address: 1312 17th Street Unit #2199, Denver, CO 80202
Email: mslus@mslsemi.com

MSL FPGA PTE. LTD. (Singapore)
Registered Address: 91 Bencoolen Street #12-03, Sunshine Plaza, Singapore 189652
Email: mslsingapore@mslsemi.com

Meishilong Technology Co., Ltd. (Hong Kong)
Registered Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung NT, Hong Kong
Email: mslhk@mslsemi.com

Meishilong Technology (Shenzhen) Co., Ltd.
2603M, Dingcheng International Building, No.7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen
Email: mslchina@mslsemi.com

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