MSL TE0830-01-ABI26FAP - MSL FPGA INC 專門從事 MSL MEISHILONG 可編程邏輯器件 FPGA 的設計與製造


Product Number	MSL TE0830-01-ABI26FAP
Category	微控制器，微處理器，FPGA 模塊
Package
Packing Method	散裝
Description	MPSOC MODULE WITH XILINX ZYNQ UL
Parameters	模組/板類型:MPU 內核\|核心處理器:Zynq UltraScale+ ZU11EG-1I\|協處理器:-\|速度:-\|閃存大小:128MB\|RAM 大小:16GB\|連接器類型:2 x 400 引腳\|大小 / 尺寸:4.724" 長 x 4.724" 寬（120.00mm x 120.00mm）\|工作溫度:-40°C ~ 85°C

Product Number

MSL TE0830-01-ABI26FAP

Category

微控制器，微處理器，FPGA 模塊

Package

Packing Method

散裝

Description

MPSOC MODULE WITH XILINX ZYNQ UL

Parameters

Contact Us:

MSL FPGA INC (USA)
Registered Address: 1312 17th Street Unit #2199, Denver, CO 80202
Email: mslus@mslsemi.com

MSL FPGA PTE. LTD. (Singapore)
Registered Address: 91 Bencoolen Street #12-03, Sunshine Plaza, Singapore 189652
Email: mslsingapore@mslsemi.com

Meishilong Technology Co., Ltd. (Hong Kong)
Registered Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung NT, Hong Kong
Email: mslhk@mslsemi.com

Meishilong Technology (Shenzhen) Co., Ltd.
2603M, Dingcheng International Building, No.7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen
Email: mslchina@mslsemi.com

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