MSL TPA311DGNR - MSL FPGA INC 專門從事 MSL MEISHILONG 可編程邏輯器件 FPGA 的設計與製造


Product Number	MSL TPA311DGNR
Category	音訊放大器
Package	8-HVSSOP
Packing Method	卷帶（TR）
Description	IC AMP CLASS AB MONO 700MW 8MSOP
Parameters	類型:AB 類\|輸出類型:1-通道（單聲道）\|不同負載時最大輸出功率 x 通道數:700mW x 1 @ 8 歐姆\|電壓 - 供電:2.5V ~ 5.5V\|特性:消除爆音，短路保護和熱保護，關閉\|安裝類型:表面貼裝型\|工作溫度:-40°C ~ 85°C（TA）

Product Number

MSL TPA311DGNR

Category

音訊放大器

Package

8-HVSSOP

Packing Method

卷帶（TR）

Description

IC AMP CLASS AB MONO 700MW 8MSOP

Parameters

Contact Us:

MSL FPGA INC (USA)
Registered Address: 1312 17th Street Unit #2199, Denver, CO 80202
Email: mslus@mslsemi.com

MSL FPGA PTE. LTD. (Singapore)
Registered Address: 709 Ang Mo Kio Avenue 8 #01-2591, Singapore 560709
Email: mslsingapore@mslsemi.com

Meishilong Technology Co., Ltd. (Hong Kong)
Registered Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung NT, Hong Kong
Email: mslhk@mslsemi.com

Meishilong Technology (Shenzhen) Co., Ltd.
2603M, Dingcheng International Building, No.7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen
Email: mslchina@mslsemi.com

Message

Online Message