MSL TPA6166A2YFFR - MSL FPGA INC 專門從事 MSL MEISHILONG 可編程邏輯器件 FPGA 的設計與製造


Product Number	MSL TPA6166A2YFFR
Category	音訊放大器
Package	25-DSBGA
Packing Method	卷帶（TR）
Description	IC AMP CLASS G STER 30MW 25DSBGA
Parameters	類型:G 類\|輸出類型:耳機，2-通道（身歷聲）\|不同負載時最大輸出功率 x 通道數:30mW x 2 @ 16歐姆\|電壓 - 供電:1.7V ~ 1.9V\|特性:消除爆音，短路保護和熱保護，關閉\|安裝類型:表面貼裝型\|工作溫度:-25°C ~ 85°C（TA）

Product Number

MSL TPA6166A2YFFR

Category

音訊放大器

Package

25-DSBGA

Packing Method

卷帶（TR）

Description

IC AMP CLASS G STER 30MW 25DSBGA

Parameters

Contact Us:

MSL FPGA INC (USA)
Registered Address: 1312 17th Street Unit #2199, Denver, CO 80202
Email: mslus@mslsemi.com

MSL FPGA PTE. LTD. (Singapore)
Registered Address: 91 Bencoolen Street #12-03, Sunshine Plaza, Singapore 189652
Email: mslsingapore@mslsemi.com

Meishilong Technology Co., Ltd. (Hong Kong)
Registered Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung NT, Hong Kong
Email: mslhk@mslsemi.com

Meishilong Technology (Shenzhen) Co., Ltd.
2603M, Dingcheng International Building, No.7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen
Email: mslchina@mslsemi.com

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