MSL TDA7266P - MSL FPGA INC 專門從事 MSL MEISHILONG 可編程邏輯器件 FPGA 的設計與製造


Product Number	MSL TDA7266P
Category	音訊放大器
Package	PowerSSO-24
Packing Method	管件
Description	3 W + 3 W DUAL BRIDGE AMPLIFIER
Parameters	類型:AB 類\|輸出類型:2 通道（身歷聲）\|不同負載時最大輸出功率 x 通道數:4W x 2 @ 8 歐姆\|電壓 - 供電:3.5V ~ 12V\|特性:-\|安裝類型:表面貼裝型\|工作溫度:0°C ~ 70°C

Product Number

MSL TDA7266P

Category

音訊放大器

Package

PowerSSO-24

Packing Method

管件

Description

3 W + 3 W DUAL BRIDGE AMPLIFIER

Parameters

Contact Us:

MSL FPGA INC (USA)
Registered Address: 1312 17th Street Unit #2199, Denver, CO 80202
Email: mslus@mslsemi.com

MSL FPGA PTE. LTD. (Singapore)
Registered Address: 91 Bencoolen Street #12-03, Sunshine Plaza, Singapore 189652
Email: mslsingapore@mslsemi.com

Meishilong Technology Co., Ltd. (Hong Kong)
Registered Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung NT, Hong Kong
Email: mslhk@mslsemi.com

Meishilong Technology (Shenzhen) Co., Ltd.
2603M, Dingcheng International Building, No.7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen
Email: mslchina@mslsemi.com

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