MSL MCP23S18-E/SP - MSL FPGA INC 專門從事 MSL MEISHILONG 可編程邏輯器件 FPGA 的設計與製造


Product Number	MSL MCP23S18-E/SP
Category	I-O 擴充器
Package	28-SPDIP
Packing Method	管件
Description	IC XPNDR 10MHZ SPI 28SDIP
Parameters	I/O 數:16\|介面:SPI\|中斷輸出:是\|特性:-\|輸出類型:開路漏極\|電流 - 灌/拉輸出:25mA\|時鐘頻率:10 MHz\|電壓 - 供電:1.8V ~ 5.5V\|工作溫度:-40°C ~ 125°C

Product Number

MSL MCP23S18-E/SP

Category

I-O 擴充器

Package

28-SPDIP

Packing Method

管件

Description

IC XPNDR 10MHZ SPI 28SDIP

Parameters

Contact Us:

MSL FPGA INC (USA)
Registered Address: 1312 17th Street Unit #2199, Denver, CO 80202
Email: mslus@mslsemi.com

MSL FPGA PTE. LTD. (Singapore)
Registered Address: 709 Ang Mo Kio Avenue 8 #01-2591, Singapore 560709
Email: mslsingapore@mslsemi.com

Meishilong Technology Co., Ltd. (Hong Kong)
Registered Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung NT, Hong Kong
Email: mslhk@mslsemi.com

Meishilong Technology (Shenzhen) Co., Ltd.
2603M, Dingcheng International Building, No.7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen
Email: mslchina@mslsemi.com

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