MSL HC9P5502B-9 - MSL FPGA INC 專門從事 MSL MEISHILONG 可編程邏輯器件 FPGA 的設計與製造


Product Number	MSL HC9P5502B-9
Category	電信
Package	24-SOIC
Packing Method	散裝
Description	EIA/ITU PABX SLIC
Parameters	功能:用戶線路介面概念（SLIC）\|介面:2 線，4 線\|電路數:1\|電壓 - 供電:-42V ~ -58V，4.75V ~ 5.25V，10.8V ~ 13.2V\|電流 - 供電:-\|功率 (W):690 mW\|工作溫度:-40°C ~ 85°C

Product Number

MSL HC9P5502B-9

Category

電信

Package

24-SOIC

Packing Method

散裝

Description

EIA/ITU PABX SLIC

Parameters

Contact Us:

MSL FPGA INC (USA)
Registered Address: 1312 17th Street Unit #2199, Denver, CO 80202
Email: mslus@mslsemi.com

MSL FPGA PTE. LTD. (Singapore)
Registered Address: 91 Bencoolen Street #12-03, Sunshine Plaza, Singapore 189652
Email: mslsingapore@mslsemi.com

Meishilong Technology Co., Ltd. (Hong Kong)
Registered Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung NT, Hong Kong
Email: mslhk@mslsemi.com

Meishilong Technology (Shenzhen) Co., Ltd.
2603M, Dingcheng International Building, No.7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen
Email: mslchina@mslsemi.com

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