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MSL HC5526CP

  • Specifications
    Product Number MSL HC5526CP
    Category 電信
    Package 22-PDIP
    Packing Method 袋
    Description ITU CO/PABX SLIC
    Parameters 功能:用戶線路介面概念（SLIC）|介面:2 線，4 線|電路數:1|電壓 - 供電:4.75V ~ 5.25V|電流 - 供電:5.5mA|功率 (W):1.5 W|工作溫度:0°C ~ 70°C

Contact Us:

MSL FPGA INC (USA)
Registered Address: 1312 17th Street Unit #2199, Denver, CO 80202
Email: mslus@mslsemi.com

MSL FPGA PTE. LTD. (Singapore)
Registered Address: 91 Bencoolen Street #12-03, Sunshine Plaza, Singapore 189652
Email: mslsingapore@mslsemi.com

Meishilong Technology Co., Ltd. (Hong Kong)
Registered Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung NT, Hong Kong
Email: mslhk@mslsemi.com

Meishilong Technology (Shenzhen) Co., Ltd.
2603M, Dingcheng International Building, No.7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen
Email: mslchina@mslsemi.com
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