中文 EN
電信

電信

Home >> Products >> 接口 >> 電信 >>

電信

MSL HC5517CB96

  • Specifications
    Product Number MSL HC5517CB96
    Category 電信
    Package 28-SOIC
    Packing Method 散裝
    Description 3 REN RINGING SLIC FOR ISDN MODE
    Parameters 功能:用戶線路介面概念（SLIC）|介面:2 線，4 線|電路數:1|電壓 - 供電:4.75V ~ 5.25V|電流 - 供電:6mA|功率 (W):300 mW|工作溫度:0°C ~ 75°C

Contact Us:

MSL FPGA INC (USA)
Registered Address: 1312 17th Street Unit #2199, Denver, CO 80202
Email: mslus@mslsemi.com

MSL FPGA PTE. LTD. (Singapore)
Registered Address: 709 Ang Mo Kio Avenue 8 #01-2591, Singapore 560709
Email: mslsingapore@mslsemi.com

Meishilong Technology Co., Ltd. (Hong Kong)
Registered Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung NT, Hong Kong
Email: mslhk@mslsemi.com

Meishilong Technology (Shenzhen) Co., Ltd.
2603M, Dingcheng International Building, No.7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen
Email: mslchina@mslsemi.com
Message
Online Message
Copyright © 2024 MSL MEI SHI LONG All Rights Reserved 粤ICP备2024280057号-1

Online Message

  • *
  • *
  • *
  • *
  • *

  • *Required fields