MSL BU8763FV-E2 - MSL FPGA INC 專門從事 MSL MEISHILONG 可編程邏輯器件 FPGA 的設計與製造


Product Number	MSL BU8763FV-E2
Category	電信
Package	16-SSOP-B
Packing Method	卷帶（TR）
Description	IC TELECOM INTERFACE SSOP-B16
Parameters	功能:Melody LSI\|介面:-\|電路數:1\|電壓 - 供電:2.7V ~ 3.6V\|電流 - 供電:-\|功率 (W):450 mW\|工作溫度:-20°C ~ 70°C

Product Number

MSL BU8763FV-E2

Category

電信

Package

16-SSOP-B

Packing Method

卷帶（TR）

Description

IC TELECOM INTERFACE SSOP-B16

Parameters

Contact Us:

MSL FPGA INC (USA)
Registered Address: 1312 17th Street Unit #2199, Denver, CO 80202
Email: mslus@mslsemi.com

MSL FPGA PTE. LTD. (Singapore)
Registered Address: 91 Bencoolen Street #12-03, Sunshine Plaza, Singapore 189652
Email: mslsingapore@mslsemi.com

Meishilong Technology Co., Ltd. (Hong Kong)
Registered Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung NT, Hong Kong
Email: mslhk@mslsemi.com

Meishilong Technology (Shenzhen) Co., Ltd.
2603M, Dingcheng International Building, No.7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen
Email: mslchina@mslsemi.com

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